TAIPEI, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc (TAIEX: 2311, NYSE: ASX), the world’s largest semiconductor assembly and test service provider, today announced it will be showcasing its System in Package (SiP) solutions in consumer and automotive applications at SEMICON China, scheduled to take place in Shanghai, China, from March 15 to 17, 2016. These SiP applications leverage on the synergy between ASE’s IC packaging, material and test technologies, with the manufactu
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