Technology | 2013.11.28
“ESiP” Creates Reliable System-in-Package Demonstrators and Receives the 2013 ENIAC JU Innovation Award
BARCELONA, Spain--(BUSINESS WIRE)--The ENIAC Joint Undertaking announced that the project “Efficient silicon multi-chip System-in-Package integration – reliability, failure analysis and test (ESiP)” received the 2013 Innovation Award for demonstrating high quality and reliability for applications from consumer to aeronautics. 40 partners from 9 countries engaged total costs of 36.1 million euro to raise to the challenges posed by heterogeneous integration, developing technologies, analytical me
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