Technology | 2012.08.15
SEMATECH Achieves World-Class Defect Reductions in EUV Mask Blanks to Enable High-Volume Manufacturing
ALBANY, N.Y.--(BUSINESS WIRE)--SEMATECH announced today that researchers have reached a significant milestone in reducing tool-generated defects from multi-layer deposition of mask blanks used for extreme ultraviolet lithography (EUVL), bringing that technology a step closer to high-volume manufacturing. Following a two-year effort to improve deposition tool hardware, process parameters and substrate cleaning techniques, technologists deposited EUV multilayers with as few as eight defects per ma
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