Technology | 2010.06.14
E-System Design, Inc. Announces New Breakthrough for 3D Interconnect Parasitic Extraction
ANAHEIM, Calif.--(BUSINESS WIRE)--E-System Design, Inc. will present a new breakthrough method for 3D interconnect extraction at the Global Semiconductor Alliance’s (GSA) 3D-IC DESIGN TOOLS & SERVICES meeting June 15th from 6:30-8:00pm. Based upon technology developed at the Georgia Institute of Technology, Package Research Center, E-System Design is developing an analysis tool capable of full wave parasitic extraction of hundreds or as will be needed soon, thousands of interconnects simulta
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