Technology | 2021.02.22
NexLogic Technologies, Inc. Announces Installation of Finetech FINEPLACER® lambda Sub-Micron Die Bonder on Its PCB Microelectronics Assembly Floor
NexLogic Technologies, Inc., an EMS provider offering both PCB SMT and microelectronics assemblies, announces the installation of a highly advanced Finetech FINEPLACER® lambda sub-micron die bonder system in its PCB microelectronics assembly line. According to the manufacturer, Finetech, the new die bonder has accuracies of 0.5 µm and is designed for precision die attach and advanced chip packaging.
(PRWeb February 22, 2021)
Read the full story at https://www.prweb.com/releases/nexlogic_technologies_inc_announces_installation_of_finetech_fineplacer_lambda_sub_micron_die_bonder_on_its_pcb_microelectronics_assembly_floor/prweb17738916.htm
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https://www.prweb.com/releases/nexlogic_[...]sembly_floor/prweb17738916.htm
