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Industry | 2016.08.10

AIM Expands White Paper on Stencil Tension and Solder Paste Print Quality

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces new white paper to be released in the coming months, titled “Evaluating the Impact of Stencil Nano-Coating and Stencil Foil Mounting Tension on Overall Print Quality of Miniaturized Devices.”

(PRWeb August 10, 2016)

Read the full story at http://www.prweb.com/releases/2016/08/prweb13606750.htm

For more information, please visit
http://www.prweb.com/releases/2016/08/prweb13606750.htm

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