AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that it will host a Knowledge Sharing Session in Guadalajara, Mexico, on July 12th, 2017. AIM’s International Technical Support Director, Carlos Tafoya, will present the white paper “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction.”
(PRWeb July 03, 2017)
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