Industry | 2017.03.13
AIM to Highlight REL61 at SMTA Intermountain (Boise) Expo & Tech Forum on March 29th, 2017
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at the SMTA Intermountain (Boise) Expo & Tech Forum, scheduled to take place March 29th, 2017 at Boise State University in Boise, Idaho. AIM will highlight their revolutionary REL61™ lead-free solder alloy, along with their full line of solder assembly materials.
(PRWeb March 13, 2017)
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