Quality | 2016.03.10
ITW Dynatec Introduces the Next Generation Dynamini™ Adhesive Supply Unit (ASU)
ITW Dynatec, a global leader in bonding and sealing solutions for the packaging industry, recently introduced a newer and more versatile Dynamini™ hot-melt adhesive supply unit (ASU). Designed to the highest industry standards for quality and performance, ITW Dynatec hot melt systems are simple to operate, highly customizable and represent a “best-total-value” for original equipment manufacturers (OEMs) in the packaging industry.
(PRWeb March 09, 2016)
Read the full story at http://www.prweb.com/releases/2016/03/prweb13252432.htm
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http://www.prweb.com/releases/2016/03/prweb13252432.htm
