Industry | 2016.02.03
Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 - Key Vendors are Applied Materials, ASMPT, DISCO, EVG, Kulicke & Sofa Industries, TEL & Tokyo Seimitsu - Research and Markets
DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/k4ks6q/global) has announced the addition of the "Global Semiconductor Packaging and Assembly Equipment Market 2016-2020" report to their offering. The report predicts that the global semiconductor packaging and assembly equipment market will grow at a CAGR of 4.68% during the period 2016-2020. The global semiconductor packaging and assembly equipment market is observing an increase in the number of M&
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http://www.businesswire.com/news/home/20[...]bly-Equipment-Market-2016-2020
