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Technology | 2015.07.02

ITW Dynatec to Showcase Proven Hot-Melt Adhesive Technology at ProPak China 2015

ITW Dynatec, a global leader in bonding and sealing solutions for the packaging industry, will present its proven hot melt application systems at ProPak China 2015, at the Shanghai New International Expo Center, Booth #5 EO1-A.

(PRWeb July 01, 2015)

Read the full story at http://www.prweb.com/releases/2015/07/prweb12820442.htm

 

For more information, please visit
http://www.prweb.com/releases/2015/07/prweb12820442.htm

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