Wednesday, June 18, 2025

Industry | 2019.08.13

AIM’s Flopy Feng to Present at SMTA China South Technical Conference

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng will present at the 2019 SMTA China South Technical Conference at the Shenzhen Convention & Exhibition Center in Shenzen, China. Flopy’s presentation, “An Update on High Reliability Lead-Free Solder Alloys,” is scheduled for Thursday, August 29th, 2019 from 14:55-15:30.

(PRWeb August 13, 2019)

Read the full story at https://www.prweb.com/releases/aims_flopy_feng_to_present_at_smta_china_south_technical_conference/prweb16500541.htm

 

For more information, please visit
https://www.prweb.com/releases/aims_flop[...]l_conference/prweb16500541.htm

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