Industry | 2016.04.19
AIM to Highlight Revolutionary M8 Solder Paste at SMT Hybrid Packaging 2016
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, will highlight their revolutionary M8 No Clean Solder Paste along with their full line of solder assembly materials in stand 7-424 at the SMT Hybrid Packaging 2016 trade show, scheduled to take place April 26th – April 28th in Nuremberg, Germany. Additionally, AIM will introduce two new, exciting lead-free solder alloys.
(PRWeb April 18, 2016)
Read the full story at http://www.prweb.com/releases/2016/04/prweb13346853.htm
For more information, please visit
http://www.prweb.com/releases/2016/04/prweb13346853.htm
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