Industry | 2018.03.05
AIM’s REL22™ Awarded Circuits Assembly’s NPI Award 2018
AIM, a leading global manufacturer of solder assembly materials for the electronics industry, announces that their REL22TM high reliability solder alloy was awarded Circuits Assembly’s New Product Introduction (NPI) Award 2018 at IPC Apex at the San Diego Convention Center.
(PRWeb March 05, 2018)
Read the full story at http://www.prweb.com/releases/2018/03/prweb15274417.htm
For more information, please visit
http://www.prweb.com/releases/2018/03/prweb15274417.htm
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